Physical AI.Specialized Compute.Production Silicon.
We take physical AI compute from a whiteboard architecture to a qualified, shipping chip: system design, FPGA prototyping, and production ASICs under one accountable team, not three vendors who have never met.
Five compute problems, one team
Every program runs through the same pipeline, architecture, prototype, silicon, tuned to the physics of where the compute actually lives.
Edge AI
Inference compute built for power and thermal budgets a data-center chip was never designed to meet. We tune the silicon to the model, not the other way around.
Robotics Compute
Perception-to-actuation stacks with deterministic, real-time control loops. Sensor fusion and motor control share a die, not a network cable.
Industrial AI
Ruggedized compute for machine vision and predictive maintenance on the factory floor, rated for the dust, heat, and vibration a server room never sees.
Specialized Silicon
Custom ASICs and SoCs for workloads that a general-purpose chip serves inefficiently, where the economics only work once the silicon is purpose-built.
Systems Architecture
Independent architecture advisory for teams choosing a compute topology before they commit capital to a chip program, the decision that is hardest to undo.
Depth at every layer of the stack
The disciplines a chip program actually needs, in-house, so architecture decisions and silicon constraints inform each other instead of colliding at tape-out.
A real supply chain, not a slide
Every program we take to silicon runs through qualified foundry, packaging, test, and manufacturing partners, the part of a chip program most teams find out too late they do not have.
Foundry
Wafer fabrication across process nodes matched to the program's performance, power, and cost targets, not the node that happened to be available.
Packaging
Die-to-package integration, from standard packages to advanced multi-die assemblies, selected for thermal and signal-integrity requirements.
Test
Wafer sort, package test, and burn-in with yield analysis fed back into design, so problems get fixed at the source, not patched downstream.
Manufacturing
Volume production and supply-chain management that carries a qualified part from first article to steady-state supply.
Published weekly, from the people building it
Teardowns, architecture reports, and supply-chain analysis written by engineers who ship silicon, not marketing summaries of someone else's silicon.
Bring us your next-generation compute problem.
One conversation, thirty minutes, with an engineer, not a sales deck. Tell us who you are and where your compute problem lives, and we will get back to you directly.